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Flip-chip process using heat transfer from an induction-heating film
Tae-Sung Oh, Kwang-Yong Lee, Yoon-Hee Lee, Boo-Yang JungVolume:
15
Language:
english
Pages:
7
DOI:
10.1007/s12540-009-0479-8
Date:
June, 2009
File:
PDF, 544 KB
english, 2009