Annealing temperature effect on the Cu-Cu bonding energy...

Metals and Materials International 2011 / 02 Vol. 17; Iss. 1

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Eun-Jung Jang, Jae-Won Kim, Bioh Kim, Thorsten Matthias, Young-Bae Park
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Volume:
17
Language:
english
Pages:
5
DOI:
10.1007/s12540-011-0214-0
Date:
February, 2011
File:
PDF, 1.06 MB
english, 2011
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