New process of electroplate Sn bumping on TSV without a PR...

Metals and Materials International 2011 / 08 Vol. 17; Iss. 4

New process of electroplate Sn bumping on TSV without a PR mould for 3D-chip stacking

Jiheon Jun, Inrak Kim, Jaepil Jung, Y. Norman Zhou
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Volume:
17
Language:
english
Pages:
5
DOI:
10.1007/s12540-011-0817-5
Date:
August, 2011
File:
PDF, 1016 KB
english, 2011
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