Chemical mechanical planarization of copper bumps on printed circuit board
MoonKi Jeong, SeungJae Jo, HyunSeop Lee, AhReum Lee, ChungYun Kang, JinWon Choi, JinHo Kim, HaeDo JeongVolume:
12
Language:
english
Pages:
4
DOI:
10.1007/s12541-011-0019-6
Date:
February, 2011
File:
PDF, 272 KB
english, 2011