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Adhesionâdelamination phenomena at the interfaces of the dielectric layer
Pan, C.T., Wu, C.N., Mao, S.W., Wang, S.Y., Ju, S.P., Wu, J.D., Yen, C.K., Chen, W.F.Volume:
18
Journal:
Results in Physics
DOI:
10.1016/j.rinp.2020.103249
Date:
September, 2020
File:
PDF, 10.99 MB
2020