Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications
Ximin Zhang, Hong Guo, Fazhang Yin, Yeming Fan, Yongzhong ZhangVolume:
30
Language:
english
Pages:
5
DOI:
10.1007/s12598-011-0204-x
Date:
February, 2011
File:
PDF, 1.22 MB
english, 2011