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Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding
Yinxia Zhang, Dong Wang, Wei Gao, Renke KangVolume:
30
Language:
english
Pages:
4
DOI:
10.1007/s12598-011-0383-5
Date:
June, 2011
File:
PDF, 483 KB
english, 2011