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Simplistic approach to reduce thermal issues in 3D IC integration technology
Rakesh, Banothu, Prasad, Dumpa, Kumari, Ch. Usha, Vighnesh, N. Arun, Suresh, M., Panigrahy, Asisa KumarJournal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2020.07.092
Date:
August, 2020
File:
PDF, 1.06 MB
2020