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CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs
Ni, Tianming, Shu, Yue, Chang, Hao, Lu, Lin, Dai, Guangzhen, Zhu, Shidong, Qu, Chengming, Huang, ZhengfengVolume:
29
Journal:
Journal of Circuits, Systems and Computers
DOI:
10.1142/S0218126620501443
Date:
September, 2020
File:
PDF, 2.11 MB
2020