CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D...

Journal of Circuits System and Computers 2020 / 09 Vol. 29; Iss. 11

CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs

Ni, Tianming, Shu, Yue, Chang, Hao, Lu, Lin, Dai, Guangzhen, Zhu, Shidong, Qu, Chengming, Huang, Zhengfeng
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Volume:
29
Journal:
Journal of Circuits, Systems and Computers
DOI:
10.1142/S0218126620501443
Date:
September, 2020
File:
PDF, 2.11 MB
2020
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