Thermal management in TSV based 3D IC Integration: A survey

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Materials Today: Proceedings 2020 / 10

Thermal management in TSV based 3D IC Integration: A survey

Kiran Sanipini, Venkata, Rakesh, Banothu, Jyothi Chamanthula, Aruna, Santoshi, N., Arunkumar Gudivada, A., Kumar Panigrahy, Asisa
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Journal:
Materials Today: Proceedings
DOI:
10.1016/j.matpr.2020.08.621
Date:
October, 2020
File:
PDF, 1.32 MB
2020
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