[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - System-Level Thermal Modeling and Its Significance in Electronics Packaging
Yuruker, Sevket U., Mandel, Raphael K., McCluskey, Patrick, Ohadi, MichaelYear:
2020
DOI:
10.1109/itherm45881.2020.9190491
File:
PDF, 1.48 MB
2020