Electromagnetic Thermal Coupling Simulation Analysis of...

Electromagnetic Thermal Coupling Simulation Analysis of Silicon Carbide Shock Absorber

Xiaofang, Yin, Xiaoning, Liu, Jiayong, Qin, Chunlin, Du
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Volume:
608
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/608/1/012009
Date:
August, 2019
File:
PDF, 669 KB
2019
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