Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes
Lin, Hao, Li, Deyao, Zhang, Liqun, Wen, Pengyan, Zhang, Shuming, Liu, Jianping, Yang, HuiVolume:
41
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/41/10/102104
Date:
October, 2020
File:
PDF, 565 KB
2020