Fabrication of Novel Geopolymer Reinforced Tin Copper...

IOP Conference Series Materials Science and Engineering 2019 / 08 Vol. 551

Fabrication of Novel Geopolymer Reinforced Tin Copper Solder in Suppressing Intermetallic Layer Growth

Nadiah ‘Izzati Binti Zulkifli, Nur, Mustafa Al Bakri Abdullah, Mohd, Arif Anuar Mohd Salleh, Mohd
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Volume:
551
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/551/1/012091
Date:
August, 2019
File:
PDF, 986 KB
2019
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