Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump
Liu, Yang, Chang, Jian, Zhou, Min, Xue, Yuxiong, Zeng, Xianghua, Sun, FenglianJournal:
Modern Physics Letters B
DOI:
10.1142/s0217984920504138
Date:
August, 2020
File:
PDF, 6.43 MB
2020