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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Dynamic mechanical properties of lead-free solder at microscale
Li, Shenzhen, Geng, Xuchen, Chen, Cong, Niu, XiaoyanYear:
2020
DOI:
10.1109/ICEPT50128.2020.9202984
File:
PDF, 360 KB
2020