A numerical study on slurry flow with CMP pad grooves

Microelectronic Engineering 2020 / 10 Vol. 234

A numerical study on slurry flow with CMP pad grooves

Hong, Seokjun, Bae, Sunghoon, Choi, Seulgi, Liu, Pengzhan, Kim, Hojoong, Kim, Taesung
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Volume:
234
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2020.111437
Date:
October, 2020
File:
PDF, 5.14 MB
2020
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