Review of microstructure and properties of low temperature...

Science and Technology of Advanced Materials 2020 / 01 Vol. 21; Iss. 1

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Xu, Kai-Kai, Zhang, Liang, Gao, Li-Li, Jiang, Nan, Zhang, Lei, Zhong, Su-Juan
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Volume:
21
Journal:
Science and Technology of Advanced Materials
DOI:
10.1080/14686996.2020.1824255
Date:
January, 2020
File:
PDF, 11.85 MB
2020
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