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[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Three-dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields on Cu Protrusion and Performance of Micro-bump Joints in TSVs Based High Bandwidth Memory (HBM) Structures
Zhou, Jie-Ying, Wang, Zheng, Wei, Cheng, Fei, Jiu-Bin, Ke, Chang-Bo, Zhang, Xin-PingYear:
2020
DOI:
10.1109/ECTC32862.2020.00260
File:
PDF, 925 KB
2020