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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Supplier Selection for High Temperature Die Attach by hybrid Entropy-Range of Value MCDM Technique: A Semiconductor Industry
Wakeel, Saif, Ahmad, Shafi, Bingol, Sedat, Bashir, M. Nasir, Pacal, Tugce Cemre, Khan, Zahid AkhtarYear:
2020
DOI:
10.1109/ICEPT50128.2020.9202994
File:
PDF, 3.72 MB
2020