[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Novel method to reduce the delamination between epoxy molding compound and lead frame silver surface
He, Chao, Feng, Colin, Li, TinaYear:
2020
DOI:
10.1109/icept50128.2020.9201907
File:
PDF, 3.04 MB
2020