[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - New Silver Alloy Bonding Wire Based on Environmentally Friendly Cathodic Passivation Protection and Its reliability
Yang, Bin, Li, Chao, Zhou, Zhangqiao, Ho, ChuMan, Hua, Xiangang, Zhang, Yu, Yang, Guannan, Lin, Tingyu, Cui, ChengqiangYear:
2020
DOI:
10.1109/icept50128.2020.9201943
File:
PDF, 943 KB
2020