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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication
Xia, Chenhui, Wang, Hui, Wang, Gang, Ming, XuefeiYear:
2020
DOI:
10.1109/icept50128.2020.9202553
File:
PDF, 2.82 MB
2020