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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Thermal-Mechanical FE Analysis of IGBT Module with Different Power Terminal Shape
Wang, Rui, Yao, ErXian, Liu, XuGuang, Pan, ZhengWei, Dong, ChangCheng, Li, WeiBangYear:
2020
DOI:
10.1109/icept50128.2020.9202631
File:
PDF, 3.13 MB
2020