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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue
Yang, Donghua, Zhai, Xiang, Zhang, Chunhong, Gan, Guisheng, Ran, Teng, Du, Fei, Fan, TaoYear:
2020
DOI:
10.1109/icept50128.2020.9202692
File:
PDF, 3.07 MB
2020