[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Research on thermal impact properties of single solder joint by RTC
Chen, Jibing, He, Zhanwen, Li, JuyingYear:
2020
DOI:
10.1109/icept50128.2020.9202697
File:
PDF, 3.86 MB
2020