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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Effects of current and bonding wires damage on high-power IGBT module reliability by electro-thermo-mechanical simulation
Huang, Qiang, Peng, Cheng, Wang, Liancheng, Zhu, WenhuiYear:
2020
DOI:
10.1109/icept50128.2020.9202868
File:
PDF, 4.11 MB
2020