[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Investigation on Plasma Cleaning Technology of Wedge Bonding
Liu, Zhidan, Zhao, Zhiping, Chen, Shuai, Zhang, FeiYear:
2020
DOI:
10.1109/icept50128.2020.9202910
File:
PDF, 3.38 MB
2020