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Foreword: Special Section on âThe Reliability of Advanced Microelectronic PackagingâPart I: Management of Thermal Effectsâ
Li, Yan, Qin, WentaoVolume:
10
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.3021317
Date:
September, 2020
File:
PDF, 249 KB
2020