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A Novel Method to Quantify Conditioner-to-Conditioner Variation and Predict Conditioner Lifetime and Process Failure Mode in Chemical Mechanical Planarization (CMP) Environment
Gowda, Akshay, Rai, Satish, Zhuang, Yun, Fan, WeiYear:
2020
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2020.3029763
File:
PDF, 2.20 MB
2020