Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys
Delhaise, André M., Bagheri, Zohreh, Meschter, Stephan, Snugovsky, Polina, Kennedy, JeffJournal:
Journal of Electronic Materials
DOI:
10.1007/s11664-020-08544-6
Date:
October, 2020
File:
PDF, 8.84 MB
2020