![](/img/cover-not-exists.png)
Heterogeneous GaN-Si integration via plasma activation direct bonding
Matsumae, Takashi, Fengwen, Mu, Fukumoto, Shoya, Hayase, Masanori, Kurashima, Yuichi, Higurashi, Eiji, Takagi, Hideki, Suga, TadatomoVolume:
852
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2020.156933
Date:
January, 2021
File:
PDF, 60 KB
2021