Impact of crystalline orientation of lead-free solder...

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Microelectronics Reliability 2020 / 10

Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

Ben Romdhane, E., Guédon-Gracia, A., Pin, S., Roumanille, P., Frémont, H.
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Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113812
Date:
October, 2020
File:
PDF, 1.75 MB
2020
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