New power module concept in PCB-embedded technology with...

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Microelectronics Reliability 2020 / 10

New power module concept in PCB-embedded technology with silver sintering die attach

Tablati, A., Alayli, N., Youssef, T., Belnoue, O., Theolier, L., Woirgard, E.
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Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113891
Date:
October, 2020
File:
PDF, 2.55 MB
2020
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