FBGA solder ball defect effect on DDR4 data signal rise...

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Microelectronics Reliability 2020 / 10

FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor

Waqar, Muhammad, Baeg, Sanghyeon, Bak, Geunyong, Kwon, Junhyeong, Lee, Kiseok, Jeon, Sang Hoon
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Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113916
Date:
October, 2020
File:
PDF, 2.52 MB
2020
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