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[IEEE 2020 IEEE International Conference on Electro Information Technology (EIT) - Chicago, IL, USA (2020.7.31-2020.8.1)] 2020 IEEE International Conference on Electro Information Technology (EIT) - Thermal Stress Analysis of Liquid-Cooled 3D-ICs

Islam, Sakib, Abdel-Motaleb, Ibrahim
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Year:
2020
DOI:
10.1109/EIT48999.2020.9208317
File:
PDF, 250 KB
2020
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