![](/img/cover-not-exists.png)
[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - A Cu-Sn/BCB Hybrid Bonding with Embedded Bump Structure
Shi, Xiuyu, Wang, Jin, Wang, Qian, He, Hongwen, Wang, Simin, Li, Heng, Sun, Menglong, Cai, JianYear:
2020
DOI:
10.1109/ICEPT50128.2020.9201931
File:
PDF, 3.17 MB
2020