[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Aligned-carbon-fibre/Silicone-rubber Composite with High Thermal Conductivity Fabricated by Double-stacked Electrostatic Flocking Method

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