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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Design and Simulation of Impedance Matching in RF Wire-bonding Structures
Zhu, Hanxiang, Li, Jun, Cao, Liqiang, Cao, Jia, Chen, PengweiYear:
2020
DOI:
10.1109/ICEPT50128.2020.9202898
File:
PDF, 3.21 MB
2020