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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Study on the Low Temperature Reliability of Leaded Solder
Wang, Xiuli, Liu, Xiaojian, Ding, Ying, Hang, Chunjin, Wu, Guangdong, Liu, Wei, Li, JiyouYear:
2020
DOI:
10.1109/icept50128.2020.9202516
File:
PDF, 4.49 MB
2020