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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Void Eliminating Process of Sintered-Silver Die Attachment in Anaerobic-Sintering Atmospheres
Liang, Peijie, Yan, Haidong, Li, Wangyun, Yang, DaoguoYear:
2020
DOI:
10.1109/icept50128.2020.9202689
File:
PDF, 3.88 MB
2020