The influence of Copper and Bismuth element in Sn-Ag...

IOP Conference Series Materials Science and Engineering 2019 / 12 Vol. 701

The influence of Copper and Bismuth element in Sn-Ag solders and ENIMAG substrate

Zolhafizi, Jaidi, Azlina, Osman. Saliza
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Volume:
701
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/701/1/012012
Date:
December, 2019
File:
PDF, 657 KB
2019
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