[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Effects of two-step plasma treatment on Cu and SiO 2 surfaces for 3D bonding applications
Seo, Han Kyeol, Eunkyung Kim, Sarah, Kim, Gahui, Park, Hae Sung, Park, Young-BaeYear:
2020
DOI:
10.1109/ECTC32862.2020.00263
File:
PDF, 852 KB
2020