[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Research on Discoloration Problem of Electrolytic Ni/Au on High Density Package Substrate
Li, Pengbo, He, Dongyu, Yu, Hongkun, Lo, Kuang-Lin, Ou, Hsien-Hsun, Cheng, XiaolingYear:
2020
DOI:
10.1109/ICEPT50128.2020.9202412
File:
PDF, 4.73 MB
2020