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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Investigation on De-embedding Methods for Package Substrate Material Electromagnetic Parameters Measurement

NIE, Xin, MIAO, Min, LI, Na
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Year:
2020
DOI:
10.1109/icept50128.2020.9202694
File:
PDF, 3.05 MB
2020
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