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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Highly strength Cu-Cu joint formation by sintering of copper nanomaterials
Lai, Tao, Zhang, Yu, Yang, Guannan, Cui, Chengqiang, Cao, Ping, Leng, JiewuYear:
2020
DOI:
10.1109/icept50128.2020.9202878
File:
PDF, 2.83 MB
2020