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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Study on Influencing Factors of Gold Wire Bonding Performance of Nickel-free Soft Gold Microwave PCB
Zhou, Bo, He, Xiao, Zou, Yabing, Li, Xingxing, He, GuanghuiYear:
2020
DOI:
10.1109/icept50128.2020.9202955
File:
PDF, 2.86 MB
2020