Measuring Interatomic Bonding and Charge Redistributions in...

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Measuring Interatomic Bonding and Charge Redistributions in Defects by Combining 4D-STEM and STEM Multislice Simulations

Heimes, Damien, Belz, Jürgen, Beyer, Andreas, Volz, Kerstin
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Journal:
Microscopy and Microanalysis
DOI:
10.1017/s1431927620014713
Date:
July, 2020
File:
PDF, 384 KB
2020
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