Simulation of Transient Liquid Phase Bonding Process and...

IOP Conference Series Materials Science and Engineering 2020 / 10 Vol. 923

Simulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness

Benita, B., Samuvel Prem Kumar, D.S., Pravin, R., Hynes, N.Samuel Dinesh, Sujana, J.Angela Jennifa
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Volume:
923
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/923/1/012006
Date:
October, 2020
File:
PDF, 686 KB
2020
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