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[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Welding reactions of lead free solder alloy for aluminum packaging electronic devices
Su, Dezhi, Guan, Peijie, Zhao, Dan, Luan, Qinghua, Wang, Cen, Niu, YuchengYear:
2020
DOI:
10.1109/icept50128.2020.9202503
File:
PDF, 4.09 MB
2020